2. OUTLINE
Introduction
Materials for flexible electronics
Technologies involved processing
Degree of flexibility
Applications
Advantages and Limitations
Conclusion
3. INTRODUCTION
Ever evolving advances in thin-film
materials and devices have fueled
many of the developments in the
field of flexible electronics.
4. MATERIALS FOR FLEXIBLE
ELECTRONICS
A generic large-area electronic structure
is composed of
Substrate
backplane electronics
Frontplane
encapsulation
5. SUBSTRATES
Flexible substrates that are to serve as drop-in
replacements for plate glass substrates must meet
many requirements:
Optical properties
Surface roughness
Thermal and thermomechanical properties
Chemical properties
Mechanical properties
Electrical and magnetic properties
6. BACKPLANE ELECTRONICS
Backplanes provide or collect power and signal to
or from frontplanes. Backplanes may be passive or
active.
Silicon Thin-Film Transistors
Organic Thin-Film Transistors
Materials for Interconnects and Contacts
8. FRONT PLANE TECHNOLOGIES
Frontplanes carry the specific optoelectronic
application.
Liquid Crystal Displays
Electrophoretic Displays
Organic Light-Emitting Displays
Sensors
9. TECHNOLOGIES AND
INTEGRATION PROCESSES
Any manufacturable device has four essential
characteristics:
Superior and pre-specified performance, with
reproducibility, uniformity, and reliability;
High yield to acceptable tolerance;
Simulations exist for both reverse engineering
during development and right-first-time design;
Proven adequate in-service lifetime.
10.
11. FABRICATION TECHNOLOGY FOR
FLEXIBLE ELECTRONICS
Fabrication on sheets by Batch Processing..
On a rigid carrier, facing up and loose;
In a tensioning frame, facing up or down;
In a frame, facing down and loose
Fabrication On Web by roll-to-roll Processing
Additive Printing
13. DEGREE OF FLEXIBILITY
Flexibility can mean many different properties
to manufacturers and users.
Degree of flexibility is given by ε = d/2r.
bendable or rollable
permanently shaped
elastically stretchable
17. OTHER APPLICATIONS
Automotive Industries
Displays and Human- machine interaction
Energy management and mobile devices
Wireless systems
Electronics Embedded in the living environment
Electronics for hostile environment etc..,
18. ADVANTAGES AND LIMITATIONS
Advantages:
Size and weight
Increased circuitry density
Boundries of design and packaging
Shape or to flex during its use
Limitations:
Lifetime
Manufacturing
Water
Battery
19. CONCLUSION
Based on the current socioeconomic trends, we
outlined some of the more likely technological
future needs and discussed the potential exploits of
thin-film flexible electronics in various market
sectors.