1. In Circuit Test for Automotive Industry
By Sam Wong
Agilent Technologies
Business Development Manager
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2. Agenda
1. The Automotive Electronics Industry
2. Challenges in the Automotive industry ICT
3. How did Agilent solved these Challenges
4. More of Agilent ICT Features to meet your needs
5. Questions and Answers
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3. Agenda
1. The Automotive Electronics Industry
2. Challenges in the Automotive industry ICT
3. How did Agilent solved these Challenges
4. More of Agilent ICT Features to meet your needs
5. Questions and Answers
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4. Automotive Electronics in Cars Today
Power Train & Hybrid
- Engine Management
- Braking System
- Power Steering
- EV and HV
Body Electronics
- Comfort / Convenience
- Instrument Cluster
- Remote Keyless Entry
- Climate Control
Infotainment &
Communications
- Audio Systems
Safety and Driver - Multimedia Systems
Assistance - Rear Seat Entertainment
- Adaptive Cruise Control
- Collision Warning
-Tire pressure Monitoring
- Airbag Time to market and market penetration periods
are becoming shorter , example ABS started in
1970s and take 20 years for mass acceptance.
It’s typically accepted to be 2 to 7 years today
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5. Agenda
1. The Automotive Electronics Industry
2. Challenges in the Automotive industry ICT
3. How did Agilent solved these Challenges
4. More of Agilent ICT Features to meet your needs
5. Questions and Answers
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6. General ICT Challenges in the Industry
LOST OF TEST ACCESS
• Increased board functionality
• Highly dense board and design complexity
INTENSE COST PRESSURE • No layout space for targets
• Fierce competition in the global market • Finer trace-spacing routing
• Customers expecting more functionality,
• Higher frequencies
better quality and at lower cost
• Lower equipment cost
Test Access (%) over the years
• Lower deployment cost
• Lower cost of ownership 100%
80%
60%
40% In Traditional ICT,
Lost of Access = Lost of
20% Test Coverage
0%
1990 1995 2000 2005 2010 2015
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7. ICT Challenges in Automotive Industry
Reduction in Cycle Time with Increasing Nodes
Count, example 1200 nodes in Engine controllers 1
and Electric Car Modules.
Increase in IC functionality, Use of Boundary Scan
in Testing and Larger Memory devices 2
Mandatory Programming of Serial Controllers and
Serial Protocol Testing (example CANBUS, 3
FlexRay, LIN)
Global deployment with hardware / fixture support
– programs transportability and guarantee 4
protection of zero unauthorized change.
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8. Challenge #1: Larger Boards and Faster Cycle Time
Production
In Pretest Challenges and
Circuit Final Programming Concerns:
with/without
Test Test Station Quality, Product
temperature
Traceability,
Costs, etc
Engine controllers modules have node counts that
are close to the limit of a single 3070 module.
Fastest
Faster
Fast
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9. Challenge #2: Larger IC with Increased functionality
Boundary scan usage
Boundary Scan usage, IC BIST and IC embedded
measurement capability will increase and be
accessible through the boundary scan port.
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10. Challenge #3: Mandatory On Board Programming
Programmable Device Market Analysis
Technology Trends
ICT Flash Programming Solution Agilent Restricted
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11. Challenge #4: Worldwide deployment Management
Cost Software revision control
Local Support for fixtures
Time Local Application expertise
Quality System configurations differences
Spare parts inventory management
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12. Agenda
1. The Automotive Electronics Industry
2. Challenges in the Automotive industry ICT
3. How did Agilent solved these Challenges
4. More of Agilent ICT Features to meet your needs
5. Questions and Answers
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13. Agilent’s respond to ICT Cost of Ownership
 Average price of a 3070 have steadily declined over 50% in the last
10 years, while test throughput has increased.
 Advanced parallel testing capability with Throughput Multiplier and
Dual Well fixturing
 2x throughput for CET and increased ICT throughput with ASRU-N
and VTEPv2.0 enhancements
 Continued R&D emphasis on
compatibility and upgradeability
with previous generation ICT, to
preserve your investments
 Lower deployment costs and
lower cost of ownership
By Bill Lycette & Duane Lowenstein, IEEE 2010 Paper, The
Real Total Cost of Ownership of Your Test Equipment
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14. Agilent’s Respond to Limited Access Challenges
Suite of Test Point Accessibility Technology
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15. Agilent’s Response to challenge #1 Platform Scalability
Larger Boards and Faster Cycle Time • S1, S2 to S5
• Expandable slots
• Module Activation
 New ASRU-N cards will give
20% to 30% faster Tests Time by
using the Digitized Measurement
Circuits
Build in Features
 Includes Power Monitoring • Panel Test
Circuit to prevent damage to ICs • Throughput Multiplier
during debug and testing • Dual Well Fixture
• Vacuum Fixture
• FPY Monitoring
Throughput by bank
Coming
Soon
A 1259 node board with 1670 Analog and 44 Digital Components
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16. Agilent’s Response to challenge #2
Larger IC and Increase in Boundary scan usage
Agilent solutions provide full support and diagnostics for IEEE 1149.1
and IEEE 1149.6
Cover Extend Technology test devices connected to Boundary Scan
components.
Leading IEEE 1149.1 extensions for IC Initialization
Leading IEEE 1149.8.1 standard – Vectorless test extensions
Participating in IEEE 3D IC test study committee
IC Embedded Measurement technology
 Multiple divisions contributing R&D, Marketing and Sales resources to
leverage Agilent’s expertise and technology to deliver embedded
measurements.
 Participating with iNEMI working group to leverage IC BIST
 Participating in IEEE P1687(IJTAG) working group
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17. NEW
COMPLETE BUNDLE AVAILABLE.
• PC Controlled (Ethernet).
• Four TAP/IO.
- 1x TAP(TMS,TCK,TDI,TDO).
- 4x Digital input ports.
- 5x Digital output ports.
• One Diagnostic Clip.
• Add-on Cover-Extend Technology capability
- Vectorless testing of ICs or Connectors through
boundary scan
• Scan Path Linker
- Connecting physically separate chains to test the
interconnecting nets
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18. Agilent’s response to challenge #3:
Mandatory On Board Serial Programming
Key benefits of Utility card flash programming
 Lower Cost
 Reduced inventory of pre-programmed device
 Fewer devices damaged by handling
 Increase flexibility in code or engineering FlashProgFR
changes by
Essepie S.R.L
 Ease of implementation
 A wide range of supported device protocols, with
extensive device coverage
 Collaboration with programmer partners, end
users will have a significant source of competitive
advantage FR3070A ISP3070
by by
SMH Xeltek
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19. Agilent’s Response to challenge #4
Worldwide Deployment Management
ONE
STOP
SHOP
ONE supplier
NEW hardware upgrades
Stable, Reliable, Repeatable System EXPERT help
• Highest accuracy and signal fidelity SOFTWARE upgrades
• Fast analog 2/4 wire Analog Stimulus TRACEABLE and trusted
Response Unit calibration
• Power monitoring protection & per pin ORIGINAL and qualified parts
programmability
PARTS availability worldwide
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20. Agenda
1. The Automotive Electronics Industry
2. Challenges in the Automotive industry ICT
3. How did Agilent solved these Challenges
4. More of Agilent ICT Features to meet your needs
5. Questions and Answers
Agilent Restricted
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21. Agilent Medalist ICT Family History
Continuous series of compatible upgrades to:
 Preserve program and fixture investments
 Extend the test capability and support life of the 3070
 Continuous product improvement and features enhancement
Provide the best balance between compatibility and low cost
The introduction of i3070 Series 5 and i1000.
Series I Series II Series III 3070 Window/i5000 i3070/i1000
1989 1994 1998 2000/2005 2007
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22. Fuse Box Test – Stage 1 Hi-Potential
Available in Agilent i1000
Start
DUT PS-HV Open Test
150V, 50uA
B Bus
A Bus DUT
(using
DUT Shorts Test
existing
Zener R=4.7k i
channel)
Volt Meter
Analog Test
Test Com
pare
Result Threshold
150V Test
i1000 Test card End
 Objective is to measure Resistance between the pins to be > 3 Mohms
 Method is to run a 150V through the nodes and make sure the current is <50uA
 The boundaries are:
Test Method and Sequence don’t damage the components
Automated and integrated into the Test Flow
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23. Fuse Box Test – Stage 2 Hi-Current Test for Relays
Available in Agilent i1000
Start  Objective is to make sure the
relays in red circles are not
misaligned
Open Test  Method: Run 1A current thru the
DUT
relays to make sure the pins can
handle 1A
Shorts Test  The boundaries are:
Hi-Current  Reed relays normal range
Relay Matrix is about 300mA
Analog Test  Automated and integrated
into Test Flow
 Test terminal voltage without
1Amp Test Max 2Amps turning on the relay
Source  Test terminal voltage with the
relay turned on while 1A is
End applied.
Measurement
Engine
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24. LED Testing
Available in Agilent i3070 Series 5 and i1000
Flexibility on the ICT to
LED Test modules add external
Using digital camera functional circuits.
Software and
Integrated with i1000D hardware support
powered test included I3070 LED Test
Technology will test your
Each module provides
FEASA LED Analyser LEDs to
154 LED tests
i1000D tests voltage and 3rd Party Solution +/-3nm for color
current
Test up to 480 LEDs in 1 Luminosity within +/-10%
LED module test color Integrated
and brightness Utility card
and 128 LEDs in <1.5
www.feasa.ie
seconds
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25. High Voltage Zener Test
Available in Agilent i3070 Series 5 08.20p
 New High Voltage Power Supply provides one output from 0 to 50
volts @ 0 to 10 amps (500W).
 Installed on Channel 3 or 4 of ASRU-N card, or can be installed on
Channel 7 or 8 on Utility card
 Support up to 60V
 Voltage references – shunt regulators
 Surge protection - to limit transient voltage spikes
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26. Use of DLL
Available in Agilent i3070 Series 5 08.30
BT-Basic External DLL External DLL
dllcall Handle_1, BTBasic_DLL_Call(“bla blank_check(0, 0xffff)
“blank_check”, nk_check”, “0, 0xffff”,
Var_1, ErrMsg$; “0, Calls ErrMsg, Var_1) Calls
0xffff”
 The DLL Integration feature allows user to call external DLL functions from
within the BT-Basics.
 New Commands:
Dllload “<dll-name>”, <dll-handle>
dllcall <dll-handle>, “<custom function name>”, [<return number>],
[“<return string>”]; [“<custom parameters>”]
 dllunload [<dll-handle>]
 Multiple DLLs are allowed to be loaded at the same time
Open up opportunities to integrate external third party devices for testing of
standards (such as CANBUS, FlexRay and LIN )
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27. Diagnostic Test System
Available in Functional Test Rack
Diagnostics Test Solution Concept
+ Just enough test 4-256 points ICT
+ Boundary scan (4 test points) for IC interconnect
+ CETBSCAN for devices connected to Boundary Scan devices
+ Utilize board-level test software for CETBIST
+ Opportunistic ICT during NPI for limited access boards
+ Standalone Repair Station or Integrated to functional tester
Other Key Features:
 4U Rack box
 RLC analog measurement
 Voltage measurement
 Frequency measurement
 Boundary Scan, Cover Extend Technology
 On Board Programming
 Digital Library Test and SPI or I2C
 Client-Server Software API
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28. Automation Ready Available in Agilent i3070
 Complete Solution from Agilent
 Built on industry leading i3070
ICT Platform
 Short Wire Fixture – preserving
core value of TRS
 Small Footprint, better mobility
 Easy maintenance and fixture
change
 Lower Upgrade costs
NEW Video Link
Card cage can be rotated 110 deg
anti-clockwise to access blower door
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29. Automation Ready Available in Agilent i1000
Off-line System In-line System
 Complete Solution from Agilent
 Smallest Foot Print ICT
 Convertible between Inline and
Offline
 Highest Top and Bottom
Clearance
 Solution for Test Access on the
Edge
 ICT with full powered testing
capabilities, with simple fixtures
NEW Video Link
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30. In-circuit Test
Technology To Meet
Future Challenges
and Trends
Measurement Systems Division
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31. Back Up
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32. Manufacturing Line – Test Strategy
Stretch $
Modular &
Compatible
Test coverage
In-line Test In-line Flash
(CAN & Functional) Programming In-line ICT
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33. Cover Extend Technology (VTEP + Boundary Scan)
CET : NOW on ICs!
Greater Throughput
Greater Coverage
Greater Usability
Greater Stability to ICT
tester …
VTEP
sensors
Boundary Scan
device
Connector or
other device
Remove Test Access
TD0
TDI
TCK
TMS Test Access
pins
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34. Bead Probe Technology (adopted by >70 companies)
Bead probes
Conventional Test
points and probes
ABPT is a patented innovation,
To be used in Agilent Testers only.
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35. Features of our i3070 over the decade
Throughput Coverage Ease of Use
LED Test
2012 Rel 8.30P Windows 7
 Ext DLL
60V Zener
2011 Rel 8.20P
N5747A Pwr Supp Unit
i3070 S5
DC test for big Caps 100KHz & 200KHz for small Caps
2010 Rel 8.10P
RP5700 PC CET on IC
Utility card TestPlan Analyzer
2009 Rel 8.00P ASRU N "AS"  Pwr Monitor Flexible Pwr Channels
 High Pwr Channels Fixture Pwr Supp
2008 Rel 7.20P VTEP v2.0 CET VTEP enhanced guarding
i3070
2008 Rel 7.10P VTEP speed up 1149.6  Enhanced Log record
IPG enhanced Switch btw Mux : Unmux
2007 Rel 7.00P  VTEP v2.0 NPM
Auto Optimizer Browser Pin locator
New GUI
 FPY, Worst Probe
2006 Rel 6.00P  XW4200 PC
AutoDebug
WinXP
2005 Rel 5.40P  iYET  iVTEP
i3070 S3
Coverage Analyst
NAND/XOR Tree Pattern User Fixture Component
2003 Rel 5.30P
VTEP Scanworks
GUI Localization
ISP suite Auto Si nails
2001 Rel 4.00P-5.20P 50% faster in sys diag
ControlXTP - SW5.0  Windows NT
Panel Test
< 2001 < Rel 4.00 Testjet
Throughput Multiplier
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36. Window 7 migration
for business continuity
after 22nd Oct 2011
Is Is not
supported on Win XP/Win 7 32-bit OS supported on Win 7 64-bit OS
the same as 08.20pb with additional developed based on new
feature to support Win 7 OS CR/enhancement
available on new system, controller available via software update
upgrade & one-time software update subscription (SUS)
Note:
1. Board test program developed in earlier Win XP software releases is transportable to 08.21p
Windows 7
2. 08.30p will support Windows 7 32/64-bit OS
3. 08.21p WinXP and 08.21p Win 7 are compatible
4. Old PCs prior to RP5700 are not supported for Win 7.
5. Version 8.21p has the same functionality as 8.20pb
6. 08.20p or earlier are not supported for Win 7
7. Microsoft does not allow Agilent to downgrade to WinXP.
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